Thin is In
You can have preforms this thin: .00015" +/- .00003", thanks to a unique patented manufacturing process. As a result, the solder material is not forced from under the die; the solder flow stops at all edges with the right size Ultra-Thin preform. (Important for some die mountings - such as P side down mounting - where solder must not flow to the side of the die).

We're Good, We're Economical.
We'll Prove It
Our Ultra-Thin preforms have the lowest price in the business (we also make a standard thickness preform, burr free, at a price lower than what you now pay). No Tooling or Set Up Charges. large or small orders, quick delivery, your alloy, your specifications. Price and quality guaranteed.

Trial Kit for No Error
A trial kit can help you eliminate production errors. With the trial kit, you can determine the right size preform to get the correct solder cover. Here's your deal in two ways: Order 180 pieces in 3 sizes, or 250 pieces in 1 size.

Features
 Locate dies much more precisely
 Solder flows evenly under your die
 Better die contact / thermal impedance /
   reliability
 Use any type die mounting - even the most
   difficult P side down mounted LASER/LED
 Easy, neat, successful soldering
 Low cost and more convenient to use than
   evaporate / sputtering for thin solder layers

Using standard .001" thick solder preform. P side down mounted laser chip has moved away from the mount edge. Solder buildup on the back facet of the chip blocks laser light.

Even using .0005" thick solder preform. Solder flows unevenly from under the large P side up mounted laser chip.

Compare with Figure 3. With an ULTRA-THIN solder preform, the solder area is even and slightly larger than the chip.

Using .00015" ULTRA-THIN solder preform. Side view of P side down mounted laser chip. No obstructing solder melt around the die.

The chip from Figure 5 is removed. Note how solder aligns at the edge of the laser chip.